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Wafer Handling

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Wafer Handling

Wafer Handling

Mactronix designs and manufactures products for all aspects of wafer handling for Semiconductor and Solar Cell Processing.Their extensive wafer handling range consists offers manual wafer handling tools, flat & notch aligners, wafer inspection and horizontal slide transfer.



  • Flat Aligner Tools (TBM-x00 & AFF-x00)


    • Wafer Size:4″, 5″, 6″ & 8″
    • Weight:5 Lbs. Approx.
    • Dimensions:4.5″ (W) x 7.5″ (D) x 3.8″ (H)


    Features & Benefits

    • Mactronix Top-Bottom Wafer Flat Finder “TBM” is designed for manual flat finder alignment.
    • The patterned side of the wafer never touches the carrier during rotation.
    • The machine may be configured to accommodate a large diversity of Plastic, Teflon, and metal carriers.
    • The aligned wafer flats may be manually positioned to any other orientation desired by slowly turning the roller knob.
    • Uptime will exceed 99.25%.
    • MTBF (mean time between failure): 2,500 hours
    • MTBA (mean time between assist): 1,000 hours
    • MTTR (mean time to repair): less than I hour

  • Notch Aligner Tools (NFM-x00 & NFA-x00)


    • Power:110-220 V.A.C. 50-60 hertz
    • Wafer Size:4″, 5″ & 6″
    • Dimensions:5.75″ (W) x 10.2″ (D) x 7.0″ (H)
    • Wafer Size:8″
    • Dimensions:6.5″ (W) x 12.0″ (D) x 7.75″ (H)
    • Weight:10 Lbs. Approx.


    Features & Benefits

    • The Notch Finder Automatic “NFA”, automatically aligns wafer notches in either the up or down
    • Notch up or down orientation is switch selectable.
    • Notch finding is automatic once the cassette is placed on the notch finder.
    • The patterned side of the wafers never touch the carrier during rotation.
    • “NFA” is carrier orientation specific so that the cassette fits in only one direction.
    • All aluminum parts are hard black anodized for corrosion resistance.

  • Manual Slide Transfer Tools (STN-x00 & STM-x00)



    • Wafer Size:4″, 5″, 6″ & 8″
    • Weight:5 Lbs. Approx.
    • Dimensions:27″ (W) x 12.25″ (D) x 7.75″ (H)



    Features & Benefits


      • The Smart Transfer Machine “STN”, manually transfers wafers between two cassettes.
      • Flat alignment is preserved during transfer.
      • Wafers are transferred from one cassette to another without scratching, breaking, or dumping.
      • Batch transfer, all sending cassette wafers are transferred at the same time to the receiving cassette, hence
        rapid transfer.
      • Wafers are never touched for the transfer, preserving wafer integrity.
      • New ergonomic handles have been added to provide maximum grip on either side and the ability to grip the tool with both hands.
      • Additional tubing on the wafer pusher provides a soft contact


    • Static Dissipative version available (Model name STE-x00)


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